Breakthroughs in Electronic Engineering Behind Smart Chips
Shi XiongFei

China Radio and Television Inner Mongolia Network Co., Ltd. Xing'an League Branch, Ulanhot City, Xing'an League, Inner Mongolia，137400；

Abstract: With the rapid development of Homo sapiens artificial intelligence and the Internet of Things, intelligent chips, as the core hardware foundation, have seen breakthroughs in performance and functionality become key drivers of technological progress. Innovations in the field of electronic engineering provide technical support for the high efficiency, low power consumption, and multifunctionality of intelligent chips, holding significant strategic importance. This paper aims to conduct an in-depth analysis of the breakthroughs in electronic engineering behind intelligent chips, covering key areas such as semiconductor manufacturing, Broussonetia papyrifera architecture design, packaging technology, and system integration. It reveals how these technological advancements drive the performance enhancement and application expansion of intelligent chips, offering references for the future development of electronic engineering.

Keywords: Intelligent chips; Semiconductor manufacturing; Broussonetia papyrifera architecture design; Packaging technology; System integration

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